Multilayer ceramic substrate and its manufacturing method

ABSTRACT

A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La&gt;Lb.

TECHNICAL FIELD

The present invention relates to a laminated ceramic substrate for constituting various electronic circuits provided in electronic devices such as portable telephones, and to a manufacturing method therefor.

BACKGROUND ART

Conventionally, in a small electronic device such as a portable telephone, it has been carried into practice that a plurality of circuit elements constituting, the device are integrated in one-chip laminated ceramic component and the laminated ceramic component is mounted on a main substrate (Patent Document 1, for example).

FIG. 11 illustrates a laminate structure of a laminated ceramic component 1, in which a plurality of ceramic layers 2 are laminated to constitute a laminated ceramic substrate 20. Formed on each surface of the ceramic layers 2 are a plurality of circuit element patterns 3 constituting an inductor or a capacitor. These circuit element patterns 3 are connected to each other by a vertical conduction path (hereinafter referred to as a via hole) 31 formed by penetrating the ceramic layers 2. A side electrode 47 is provided on a side surface of the laminated ceramic substrate 20 and connected to the circuit element patterns 3.

A cavity 21 is provided on a surface of the laminated ceramic substrate 20. An electronic component 4 such as a surface acoustic wave filter is mounted on a bottom surface of the cavity 21. The electronic component 4 is connected to the circuit element patterns 3 through a bonding wire 32.

A lid 5 covering the cavity 21 is placed on the surface of the laminated ceramic substrate 20 to constitute the laminated ceramic component 1 packaged.

The above-described laminated ceramic substrate 20 is manufactured by the steps shown in FIG. 10.

First, as shown in FIG. 10(a), a green sheet 25 including a ceramic mixed material is prepared. Next, as shown in FIG. 10(b), a through hole 22 for a cavity, a through hole for a via hole (not shown), and a circular-shaped through hole 23 for a side electrode are provided at desired locations of the green sheet 25. Thereafter, as shown in FIG. 10(c), the through hole for a via hole and the through hole 23 for a side electrode are filled with a conductive material 24. Subsequently, as shown in FIG. 10(d), the conductive material 24 is printed on a surface of the green sheet 25 to form a circuit element pattern 30.

Green sheets 25 thus obtained are laminated and thereafter integrated by heat press or other methods to prepare a green-sheet laminated body 26 shown in FIG. 10(e).

Thereafter, as shown in FIG. 10(f), the green-sheet laminated body 26 is divided for each cavity 21 to obtain a plurality of green-sheet laminated body chips 27. Then, as shown in FIG. 10(g), each of the green-sheet laminated body chips 27 is fired to obtain the laminated ceramic substrate 20.

As shown in FIG. 11, the electronic component 4 is mounted on the bottom surface of the cavity 21 of the laminated ceramic substrate 20 thus obtained. Then wire bonding is applied thereto and the lid 5 is placed to thereby complete the laminated ceramic component 1.

[Patent Document 1] U.S. Pat. No. 3,336,913, FIG. 6(b)

A conventional laminated ceramic substrate includes a semicircular side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. This can be obtained because a circular-shaped through hole for a side electrode is filled with a conductive material and thereafter divided. FIG. 4(a) is a partial top view in the vicinity of a circular-shaped through hole 23 for a side electrode of a conventional green-sheet laminated body 26. Through holes 23 a, 23 b, and 23 c for a side electrode each have the same shape. For example, a green sheet 25 a is disposed on a designed center in a side-electrode width direction and on a designed center in a side-electrode depth direction with a green sheet 25 b laminated thereon shifted from the designed center in the side-electrode width direction to the left in the drawing by X1 greater than the radius of the through hole for a side electrode and a green sheet 25 c further laminated thereon shifted from the designed center in the side-electrode width direction to the right in the drawing by X2 greater than the radius of the through hole for a side electrode. The green sheets 25 b and 25 c are both disposed on the designed center in the side-electrode depth direction. A width direction center of the through hole 23 a for a side electrode of the green sheet 25 a is the same as the designed center 43 in the side-electrode width direction. In contrast, a width direction center 42 b of the through hole 23 b for a side electrode of the green sheet 25 b is shifted from the designed center 43 in the side-electrode width direction to the left in the drawing by the shift amount X1. A width direction center 42 c of the through hole 23 c for a side electrode of the green sheet 25 c is also shifted from the designed center 43 in the side-electrode width direction to the right in the drawing by the shift amount X2.

FIG. 4(b) is a partial side view in the vicinity of a side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 a-45 a (same as the designed center 45 in the side-electrode depth direction). As seen in the drawing, side edge electrode layers 41 a, 41 b, and 41 c that must essentially be electrically connected are disconnected at a border between the neighboring side edge electrode layers 41 b and 41 c of the green sheets 25 b and 25 c, respectively, resulting in a laminated ceramic substrate with a disconnection defect.

FIG. 6(a) is a partial top view in the vicinity of a circular-shaped through hole 23 for a side electrode of a conventional green-sheet laminated body 26. Through holes 23 d, 23 e, and 23 f for a side electrode each have the same shape. For example, a green sheet 25 d is disposed on a designed center in a side-electrode width direction and on a designed center in a side-electrode depth direction with a green sheet 25 e laminated thereon shifted from the designed center in the side-electrode depth direction to the bottom in the drawing by Y3 smaller than the radius of the through hole for a side electrode and shifted from the designed center in the side-electrode width direction to the left in the drawing by X3 smaller than the radius of the through hole for a side electrode, and with a green sheet 25 f further laminated thereon shifted from the designed center in the side-electrode depth direction to the top in the drawing by Y4 smaller than the radius of the through hole for a side electrode and shifted from the designed center in the side-electrode width direction to the right in the drawing by X4 smaller than the radius of the through hole for a side electrode. A depth direction center and a width direction center of the through hole 23 d for a side electrode of the green sheet 25 d are the same as the designed center 45 in the side-electrode depth direction and the designed center 43 in the side-electrode width direction, respectively. In contrast, a depth direction center 44 e of the through hole 23 e for a side electrode of the green sheet 25 e is shifted from the designed center 45 in the side-electrode depth direction to the bottom in the drawing by the shift amount Y3 and a width direction center 42 e of the through hole 23 e for a side electrode of the green sheet 25 e is shifted from the designed center 43 in the side-electrode width direction to the left in the drawing by the shift amount X3. A depth direction center 44 f of the through hole 23 f for a side electrode of the green sheet 25 f is also shifted from the designed center 45 in the side-electrode depth direction to the top in the drawing by the shift amount Y4 and a width direction center 42 f of the through hole 23 f for a side electrode of the green sheet 25 f is also shifted from the designed center 43 in the side-electrode width direction to the right in the drawing by the shift amount X4.

FIG. 6(b) is a partial side view in the vicinity of a side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 b-45 b (same as the designed center 45 in the side-electrode depth direction). As seen in the drawing, even if each of the shift amounts Y3 and Y4 in the depth direction and each of the shift amounts X3 and X4 in the width direction of the green sheets 25 e and 25 f are both smaller than the radius of the side electrode, side edge electrode layers 41 d, 41 e, and 41 f that must essentially be electrically connected are disconnected at a border between the neighboring side edge electrode layers 41 e and 41 f of the green sheets 25 e and 25 f, respectively, resulting in a laminated ceramic substrate with a disconnection defect.

FIG. 8(a) is a partial top view in the vicinity of a circular-shaped through hole 23 for a side electrode of a conventional green-sheet laminated body 26. Through holes 23 m, 23 n, and 230 for a side electrode each have the same shape. For example, green sheets 25 m and 25 o are shifted from a designed center in a side-electrode depth direction to the top in the drawing by Y5 smaller than the radius of the through hole for a side electrode with a green sheet 25 n laminated thereon shifted from the designed center in the side-electrode depth direction to the bottom in the drawing by Y6 greater than the radius of the through hole for a side electrode. The green sheets 25 m, 25 n, and 25 o are all disposed on the designed center in the side-electrode width direction. Depth direction centers 44 m and 44 o of the through holes 23 m and 23 o for a side electrode of the green sheets 25 m and 25 o are shifted from the designed center 45 in the side electrode-depth direction to the top in the drawing by the shift amount Y5. A depth direction center 44 n of the through hole 23 n for a side electrode of the green sheet 25 n is also shifted from the designed center 45 in the side-electrode depth direction to the bottom in the drawing by the shift amount Y6.

FIG. 8(b) is a partial sectional view in the vicinity of a side electrode in which the green-sheet laminated body 26 is divided along a line 43 c-43 c (same as the designed center 43 in the side-electrode width direction). As seen in the drawing, the through holes 23 m, 23 n, and 230 for a side electrode that must essentially be electrically connected are disconnected at a border between the neighboring through holes 23 m and 23 n for a side electrode of the green sheets 25 m and 25 n, respectively, and at a border between the neighboring through holes 23 n and 230 for a side electrode of the green sheets 25 n and 250, respectively. A side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 c-45 c (same as the designed center 45 in the side-electrode depth direction) is to be disconnected, resulting in a laminated ceramic substrate with a disconnection defect.

As described above, there has been a problem that a disconnection defect caused by lamination shift may reduce production yield of a laminated ceramic substrate 20.

Accordingly, an object of the present invention is to provide a laminated ceramic substrate and a manufacturing method therefor in which occurrences of a disconnection defect of a laminated ceramic substrate 20 caused by green sheet lamination shift are reduced.

DISCLOSURE OF THE INVENTION

The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb. A manufacturing method includes a step shown in FIG. 10(b) of providing a through hole for a via hole and a through hole 23 for a side electrode at desired locations of a green sheet 25, in which the through hole 23 for a side electrode has at least four straight-line portions as shown in FIG. 3(a).

FIG. 3(a) is a partial top view in the vicinity of a through hole 23 for a side electrode of a green-sheet laminated body 26 of the present invention. Through holes 23 g, 23 h, and 23 i for a side electrode each have the same shape, and a depth direction dimension thereof (dimension between 46 a-46 a) is equal to the diameter of the circular-shaped through hole for a side electrode in FIG. 4. A length of two opposite flat walls 46 a of the through hole for a side electrode is greater than ½ of the dimension between the flat walls 46 a-46 a. Each of shift amounts of three green sheets from a designed center in a side-electrode width direction and from a designed center in a side-electrode depth direction is also exactly the same as that in FIG. 4. That is, a green sheet 25 g is disposed on the designed center in the side-electrode width direction and on the designed center in the side-electrode depth direction with a green sheet 25 h laminated thereon shifted from the designed center in the side-electrode width direction to the left in the drawing by X1 greater than ½ of the depth of the through hole for a side electrode and a green sheet 25 i further laminated thereon shifted from the designed center in the side-electrode width direction to the right in the drawing by X2 greater than ½ of the depth of the through hole for a side electrode. The green sheets 25 h and 25 i are both disposed on the designed center in the side-electrode depth direction. A width direction center of the through hole 23 g for a side electrode of the green sheet 25 g is the same as the designed center 43 in the side-electrode width direction. In contrast, a width direction center 42 h of the through hole 23 h for a side electrode of the green sheet 25 h is shifted from the designed center 43 in the side-electrode width direction to the left in the drawing by the shift amount X1. A width direction center 42 i of the through hole 23 i for a side electrode of the green sheet 25 i is also shifted from the designed center 43 in the side-electrode width direction to the right in the drawing by the shift amount X2.

FIG. 3(b) is a partial side view in the vicinity of a side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 a-45 a (same as the designed center 45 in the side-electrode depth direction). As seen in the drawing, neighboring side edge electrode layers 41 h and 41 i of the green sheets 25 h and 25 i, respectively, partially overlap to prevent the disconnection at the border found conventionally, free from a disconnection defect.

FIG. 5(a) is a partial top view in the vicinity of a through hole 23 for a side electrode of a green-sheet laminated body 26 of the present invention. Through holes 23 j, 23 k, and 231 for a side electrode each have the same shape, and a depth direction dimension thereof (dimension between 46 b-46 b) is equal to the diameter of the circular-shaped through hole for a side electrode in FIG. 6. A length of two opposite flat walls 46 b of the through hole for a side electrode is greater than ½ of the dimension between the flat walls 46 b-46 b. Each of shift amounts of three green sheets from a designed center in a side-electrode width direction and from a designed center in a side-electrode depth direction is also exactly the same as that in FIG. 6. That is, a green sheet 25 j is disposed on the designed center in the side-electrode width direction and on the designed center in the side-electrode depth direction with a green sheet 25 k laminated thereon shifted from the designed center in the side-electrode depth direction to the bottom in the drawing by Y3 smaller than ½ of the depth of the through hole for a side electrode and shifted from the designed center in the side-electrode width direction to the left in the drawing by X3 smaller than ½ of the depth of the through hole for a side electrode, and with a green sheet 251 further laminated thereon shifted from the designed center in the side-electrode depth direction to the top in the drawing by Y4 smaller than ½ of the depth of the through hole for a side electrode and shifted from the designed center in the side-electrode width direction to the right in the drawing by X4 smaller than ½ of the depth of the through hole for a side electrode. A depth direction center and a width direction center of the through hole 23 j for a side electrode of the green sheet 25 j are the same as the designed center 45 in the side-electrode depth direction and the designed center 43 in the side-electrode width direction, respectively. In contrast, a depth direction center 44 k of the through hole 23 k for a side electrode of the green sheet 25 k is shifted from the designed center 45 in the side-electrode depth direction to the bottom in the drawing by the shift amount Y3 and a width direction center 42 k of the through hole 23 k for a side electrode of the green sheet 25 k is shifted from the designed center 43 in the side-electrode width direction to the left in the drawing by the shift amount X3. A depth direction center 441 of the through hole 231 for a side electrode of the green sheet 251 is also shifted from the designed center 45 in the side-electrode depth direction to the top in the drawing by the shift amount Y4 and a width direction center 421 of the through hole 231 for a side electrode of the green sheet 251 is also shifted from the designed center 43 in the side-electrode width direction to the right in the drawing by the shift amount X4.

FIG. 5(b) is a partial side view in the vicinity of a side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 b-45 b (same as the designed center 45 in the side-electrode depth direction). As seen in the drawing, neighboring side edge electrode layers 41 k and 411 of the green sheets 25 k and 251, respectively, partially overlap to prevent the disconnection at the border found conventionally, free from a disconnection defect.

FIG. 7(a) is a partial top view in the vicinity of a through hole 23 for a side electrode of a green-sheet laminated body 26 of the present invention. Through holes 23 p and 23 r for a side electrode each have the same shape, and a depth direction dimension thereof (dimension between 46 c-46 c) is equal to the diameter of the circular-shaped through hole for a side electrode in FIG. 8. A depth direction dimension of a through hole 23 q for a side electrode (dimension between 46 d-46 d) is greater than the diameter of the circular-shaped through hole for a side electrode in FIG. 8. A length of two opposite flat walls 46 c of each of the through holes 23 p and 23 r for a side electrode is greater than ½ of the dimension between the flat walls 46 c-46 c. A length of two opposite flat walls 46 d of the through hole 23 q for a side electrode is greater than ½ of the dimension between the flat walls 46 d-46 d. Each of shift amounts of three green sheets from a designed center in a side-electrode width direction and from a designed center in a side-electrode depth direction is also exactly the same as that in FIG. 8. That is, green sheets 25 p and 25 r are shifted from the designed center in the side-electrode depth direction to the top in the drawing by Y5 smaller than ½ of the depth of the through hole 23 p for a side electrode with a green sheet 25 q laminated thereon shifted from the designed center in the side-electrode depth direction to the bottom in the drawing by Y6 greater than ½ of the depth of the through hole 23 p for a side electrode. The green sheets 25 p, 25 q, and 25 r are all disposed on the designed center in the side-electrode width direction. Depth direction centers 44 p and 44 r of the through holes 23 p and 23 r for a side electrode of the green sheets 25 p and 25 r are shifted from the designed center 45 in the side-electrode depth direction to the top in the drawing by the shift amount Y5. A depth direction center 44 q of the through hole 23 q for a side electrode of the green sheet 25 q is also shifted from the designed center 45 in the side-electrode depth direction to the bottom in the drawing by the shift amount Y6.

FIG. 7(b) is a partial sectional view in the vicinity of a side electrode in which the green-sheet laminated body 26 is divided along a line 43 c-43 c (same as the designed center 43 in the side-electrode width direction). As seen in the drawing, the neighboring through holes 23 p and 23 q for a side electrode of the green sheets 25 p and 25 q, respectively, and the neighboring through holes 23 q and 23 r for a side electrode of the green sheets 25 q and 25 r, respectively, each partially overlap. Thus, a side electrode of a green-sheet laminated body chip 27 obtained by dividing the green-sheet laminated body 26 along a line 45 c-45 c (same as the designed center 45 in the side-electrode depth direction) is prevented from disconnections at the borders, resulting in a laminated ceramic substrate free from a disconnection defect.

As described above, a side edge electrode layer including a parallel wall unexposed and approximately parallel to a side surface of a laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate, in which a length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb, can decrease an occurrence rate of disconnections of a side electrode caused by lamination shift, and therefore can decrease disconnection defects of the laminated ceramic substrate to improve production yield of the laminated ceramic substrate.

FIG. 9(a) is a front view of a laminated ceramic substrate 20. FIGS. 9(b) to (d) are schematic sectional views in which the laminated ceramic substrate 20 is divided along a line 60-60. A side edge electrode layer 47 is only shown for simplification of the drawings.

Odd number green sheets from the top layer provided with a through hole for a side electrode having a double depth of a depth Lb of the side edge electrode layer and even number green sheets from the top layer provided with a through hole for a side electrode having a greater depth than that of the through hole for a side electrode of the odd number green sheets are laminated alternately to complete the laminated ceramic substrate. FIG. 9(b) shows a cross section of the laminated ceramic substrate, in which ceramic layers 2 a with a side edge electrode layer 41 having a smaller depth and ceramic layers 2 b with a side edge electrode layer 41 having a greater depth are alternated from the top layer to the bottom layer, that is, a sum of depths of opposite side edge electrode layers 41 LbL+LbR partially differs with respect to a laminated direction. This can further decrease an occurrence rate of disconnections of a side electrode caused by lamination shift.

As shown in FIG. 9(c), a side edge electrode layer 41 having a greater depth may be provided only on a ceramic layer 2 c formed with a green sheet that may easily cause lamination shift such as a thin green sheet or a green sheet having a large area GND pattern printed thereon. A side edge electrode layer 41 having a greater depth may also be provided only on a layer directly above and/or directly below the ceramic layer 2 c as shown in FIG. 9(d).

The number and position of ceramic layers provided with a side edge electrode layer 41 having a greater depth are not limited, but preferably, the number of ceramic layers provided with a side edge electrode layer 41 having a greater depth is limited to a minimum necessary because a side edge electrode layer 41 with a greater depth makes narrower an area in which a circuit element pattern 3 is disposed on the ceramic layers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 includes a partial top view and a partial perspective view according to Example 1 of the present invention;

FIG. 2 includes a partial top view and a partial perspective view according to Example 2 of the present invention;

FIG. 3 illustrates one step of a laminated ceramic substrate of the present invention;

FIG. 4 illustrates one step of a laminated ceramic substrate of a conventional example;

FIG. 5 illustrates one step of a laminated ceramic substrate of the present invention;

FIG. 6 illustrates one step of a laminated ceramic substrate of a conventional example;

FIG. 7 illustrates one step of a laminated ceramic substrate of the present invention;

FIG. 8 illustrates one step of a laminated ceramic substrate of a conventional example;

FIG. 9 includes a front view and schematic sectional views of a laminated ceramic substrate of the present invention;

FIG. 10 illustrates a series of the steps of a laminated ceramic substrate of the present invention and a conventional example; and

FIG. 11 is a sectional view of a laminated ceramic component using a laminated ceramic substrate of the present invention and a conventional example.

BEST MODE FOR CARRYING OUT THE INVENTION

A description of embodiments of the present invention will be given below with reference to the drawings.

A laminated ceramic substrate 20 of the present invention is constituted by laminating a plurality of ceramic layers 2 as shown in FIG. 11. Formed on each surface of the ceramic layers 2 are a plurality of circuit element patterns 3 constituting an inductor or a capacitor. The circuit element patterns 3 are connected to each other by a via hole 31 formed by penetrating the ceramic layers 2. A side electrode 47 is provided on a side surface of the laminated ceramic substrate 20 and connected to the circuit element patterns 3. A cavity 21 is provided on a surface of the laminated ceramic substrate 20.

A laminated ceramic component 1 using the laminated ceramic substrate 20 has an electronic component 4 such as a surface acoustic wave filter mounted on a bottom surface of the cavity 21. The electronic component 4 is connected to the circuit element patterns 3 through a bonding wire 32. A lid 5 covering the cavity 21 is placed on the surface of the laminated ceramic substrate 20 to constitute the laminated ceramic component 1 packaged.

The above-described laminated ceramic substrate 20 is manufactured by the steps shown in FIG. 10.

First, as shown in FIG. 10(a), a green sheet 25 including a ceramic mixed material is prepared. Next, as shown in FIG. 10(b), a through hole 2 for a cavity, a through hole for a via hole, and a through hole 23 for a side electrode are provided at desired locations of the green sheet 25.

The through hole for a via hole and the through hole 23 for a side electrode of a plurality of green sheets 25 thus obtained are filled with a conductive material 24.

Thereafter, a circuit element pattern 30 is printed on a surface of the plurality of green sheets 25 with the conductive material 24. The green sheets 25 thus obtained are laminated and integrated by heat press or other methods to prepare a green-sheet laminated body 26.

Next, as shown in FIG. 10(f), the green-sheet laminated body 26 is divided for each cavity 21 to obtain a plurality of green-sheet laminated body chips 27. Then, as shown in FIG. 10(g), each of the green-sheet laminated body chips 27 is fired to obtain the laminated ceramic substrate 20.

EXAMPLE 1

FIG. 1(a) is a partial top view in the vicinity of a side electrode of a laminated ceramic substrate according to the present invention. FIG. 1(b) is a partial perspective view in the vicinity of the side electrode of the ceramic substrate. Provided on a side surface of the laminated ceramic substrate 20 is a side electrode 47 in which side edge electrode layers 41 overlap and connect from the top layer to the bottom layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to the side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.

Furthermore, the parallel wall and perpendicular wall are connected by a corner portion 46 with an R-shape. Failure to provide the R-shape may easily cause a shortage of a conductive material 24 because the corner portion 46 without the R-shape is difficult to fill with the conductive material 24. This may decrease a contact area after firing between a conductive material side wall and ceramic side wall of the side electrode 47 of the laminated ceramic substrate 20, resulting in low peel strength of the side electrode 47 against the ceramic part. Moreover, an attempt to completely fill the corner portion 46 with the conductive material 24 may complicate the management of the filling step to lower the productivity. Therefore, preferably, the corner portion 46 has an R-shape like the present example. The range of R is sufficient if greater than 0.02 mm.

EXAMPLE 2

FIG. 2(a) is a partial top view in the vicinity of a side electrode of a laminated ceramic substrate according to a second example of the present invention. FIG. 2(b) is a partial perspective view in the vicinity of the side electrode of the ceramic substrate. In the side electrode on a side surface of the laminated ceramic substrate 20, the top layer fails to have a side edge electrode layer, but each layer from the second top layer to the bottom layer has a side edge electrode layer. The present example shows the top layer without a side edge electrode layer, but a layer without a side edge electrode layer is not limited to the top layer and may be another layer or a plurality of layers.

In the present examples, the green-sheet laminated body 26 is divided and thereafter fired, but the same effect can of course be obtained even if the green-sheet laminated body 26 is fired and thereafter divided. Furthermore, the filling of the through hole for a via hole and the through hole 23 for a side electrode with the conductive material 24 may be performed simultaneously with the printing of the circuit element pattern 30 on the surface of the green sheet 25 with the conductive material 24.

Embodiments of the present invention are described above specifically with examples, but the present invention is not limited to these examples.

INDUSTRIAL APPLICABILITY

The present invention can decrease an occurrence rate of disconnections of a side electrode caused by lamination shift, and therefore can decrease disconnection defects of a laminated ceramic substrate to improve production yield of the laminated ceramic substrate. 

1. A laminated ceramic substrate formed by laminating ceramic layers each having a circuit element pattern formed on a surface thereof, the laminated ceramic substrate comprising a side electrode in which a side edge electrode layer formed on a side edge portion of the ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer, the side edge electrode layer comprising a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate, a length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate having a relationship of La>Lb.
 2. A laminated ceramic substrate according to claim 1, wherein the parallel wall and perpendicular wall are connected by a corner portion with an R-shape in which R is greater than 0.02 mm.
 3. A laminated ceramic substrate according to claim 1, wherein a sum of depths of opposite side edge electrode layers partially differs with respect to a laminated direction.
 4. A manufacturing method for a laminated ceramic substrate formed by laminating ceramic layers each having a circuit element pattern formed on a surface thereof, the manufacturing method for the laminated ceramic substrate comprising a step of providing a through hole for a side electrode including at least four straight-line portions in a green sheet to become a ceramic layer.
 5. A manufacturing method for a laminated ceramic substrate according to claim 4, wherein the through hole for a side electrode provided in at least one green sheet differs in size from a through hole for a side electrode provided in another green sheet.
 6. A manufacturing method for a laminated ceramic substrate formed by laminating ceramic layers each having a circuit element pattern formed on a surface thereof according to claim 4, the manufacturing method for the laminated ceramic substrate comprising: a first step of preparing a plurality of green sheets to become ceramic layers and providing in a required number of the green sheets thereof a through hole for a via hole to become a circuit element pattern and a through hole for a side electrode including at least four straight-line portions; a second step of filling the through hole for a via hole and through hole for a side electrode of the plurality of green sheets after the first step with a conductive material; a third step of printing a circuit element pattern with the conductive material on each surface of the plurality of green sheets after the second step; a fourth step of laminating the green sheets after the third step and integrating the green sheets by heat press or other methods to obtain a green sheet laminated body; a fifth step of dividing the green sheet laminated body after the fourth step to obtain a green sheet laminated body chip; and a sixth step of firing the green sheet laminated body chip after the fifth step to obtain the laminated ceramic substrate.
 7. A manufacturing method for a laminated ceramic substrate according to claim 4, comprising: a fifth step of firing the green sheet laminated body after the fourth step to obtain a mother laminated ceramic substrate; and a sixth step of dividing the mother laminated ceramic substrate after the fifth step to obtain the laminated ceramic substrate.
 8. A manufacturing method for a laminated ceramic substrate according to claim 4, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 9. A laminated ceramic substrate according to claim 2, wherein a sum of depths of opposite side edge electrode layers partially differs with respect to a laminated direction.
 10. A manufacturing method for a laminated ceramic substrate formed by laminating ceramic layers each having a circuit element pattern formed on a surface thereof according to claim 5, the manufacturing method for the laminated ceramic substrate comprising: a first step of preparing a plurality of green sheets to become ceramic layers and providing in a required number of the green sheets thereof a through hole for a via hole to become a circuit element pattern and a through hole for a side electrode including at least four straight-line portions; a second step of filling the through hole for a via hole and through hole for a side electrode of the plurality of green sheets after the first step with a conductive material; a third step of printing a circuit element pattern with the conductive material on each surface of the plurality of green sheets after the second step; a fourth step of laminating the green sheets after the third step and integrating the green sheets by heat press or other methods to obtain a green sheet laminated body; a fifth step of dividing the green sheet laminated body after the fourth step to obtain a green sheet laminated body chip; and a sixth step of firing the green sheet laminated body chip after the fifth step to obtain the laminated ceramic substrate.
 11. A manufacturing method for a laminated ceramic substrate according to claim 5, comprising: a fifth step of firing the green sheet laminated body after the fourth step to obtain a mother laminated ceramic substrate; and a sixth step of dividing the mother laminated ceramic substrate after the fifth step to obtain the laminated ceramic substrate.
 12. A manufacturing method for a laminated ceramic substrate according to claim 6, comprising: a fifth step of firing the green sheet laminated body after the fourth step to obtain a mother laminated ceramic substrate; and a sixth step of dividing the mother laminated ceramic substrate after the fifth step to obtain the laminated ceramic substrate.
 13. A manufacturing method for a laminated ceramic substrate according to claim 10, comprising: a fifth step of firing the green sheet laminated body after the fourth step to obtain a mother laminated ceramic substrate; and a sixth step of dividing the mother laminated ceramic substrate after the fifth step to obtain the laminated ceramic substrate.
 14. A manufacturing method for a laminated ceramic substrate according to claim 5, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 15. A manufacturing method for a laminated ceramic substrate according to claim 6, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 16. A manufacturing method for a laminated ceramic substrate according to claim 10, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 17. A manufacturing method for a laminated ceramic substrate according to claim 7, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 18. A manufacturing method for a laminated ceramic substrate according to claim 11, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 19. A manufacturing method for a laminated ceramic substrate according to claim 12, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets.
 20. A manufacturing method for a laminated ceramic substrate according to claim 13, wherein the second step of filling the through hole for a via hole and through hole for a side electrode with the conductive material is performed simultaneously with the third step of printing the circuit element pattern with the conductive material on each surface of the green sheets. 